Features On-Die ECC: Yes CAS latency: 40 Memory layout (modules x size): 1 x 32 GB Internal memory: 32 GB Memory form factor: 262-pin SO-DIMM ECC: No Cooling type: Heatsink Component for: Laptop Memory voltage: 1.1 V Buffered memory type: Unregistered (unbuffered) Internal memory type: DDR5 Intel Extreme Memory Profile (XMP): Yes Row active time: 28.56 ns Lead plating: Gold Intel Extreme Memory Profile (XMP) version: 3.0 Memory data transfer rate: 5600 MT/s Row cycle time: 48 ns Module configuration: 4096M x 64 Programming power voltage (VPP): 1.8 V SPD profile: Yes JEDEC standard: Yes Refresh row cycle time: 295 ns
Operational conditions Operating temperature (T-T): 0 - 85 °C Storage temperature (T-T): -55 - 100 °C
Weight & dimensions Depth: 69.6 mm Height: 30 mm Weight: 10 g Width: 3.8 mm
Packaging data Package height: 171.4 mm Package depth: 14 mm Package weight: 26.72 g Package width: 57.1 mm
Safety warning Warnings: Do not disassemble or damage the memory modules, they may contain substances hazardous to health., Disposal of electronic products should be in accordance with local regulations for the recycling of electronic equipment., Keep out of the reach of children.