Features On-Die ECC: Yes Programming power voltage (VPP): 1.8 V SPD profile: Yes JEDEC standard: Yes Memory data transfer rate: 5600 MT/s Row active time: 28.56 ns CAS latency: 40 Module configuration: 2048M x 64 Refresh row cycle time: 295 ns Internal memory: 32 GB Memory layout (modules x size): 2 x 16 GB Row cycle time: 48 ns Intel Extreme Memory Profile (XMP): Yes Lead plating: Gold Component for: Laptop Cooling type: Heatsink Memory form factor: 262-pin SO-DIMM ECC: No Intel Extreme Memory Profile (XMP) version: 3.0 Memory voltage: 1.1 V Buffered memory type: Unregistered (unbuffered) Internal memory type: DDR5
Operational conditions Storage temperature (T-T): -55 - 100 °C Operating temperature (T-T): 0 - 85 °C
Weight & dimensions Weight: 16.8 g Depth: 69.6 mm Height: 30 mm Width: 3.8 mm
Packaging data Package depth: 14 mm Package height: 171.4 mm Package weight: 46.21 g Package width: 95.2 mm
Safety warning Warnings: Do not disassemble or damage the memory modules, they may contain substances hazardous to health., Keep out of the reach of children., Disposal of electronic products should be in accordance with local regulations for the recycling of electronic equipment.