Features On-Die ECC: Yes Memory voltage: 1.1 V ECC: No Lead plating: Gold Memory form factor: 262-pin SO-DIMM Internal memory type: DDR5 Cooling type: Heatsink Module configuration: 4096M x 64 SPD profile: Yes CAS latency: 40 Buffered memory type: Unregistered (unbuffered) Memory layout (modules x size): 2 x 32 GB Memory data transfer rate: 5600 MT/s Programming power voltage (VPP): 1.8 V Row cycle time: 48 ns Component for: Laptop JEDEC standard: Yes Row active time: 28.56 ns Internal memory: 64 GB Refresh row cycle time: 295 ns Intel Extreme Memory Profile (XMP) version: 3.0 Intel Extreme Memory Profile (XMP): Yes
Operational conditions Storage temperature (T-T): -55 - 100 °C Operating temperature (T-T): 0 - 85 °C
Weight & dimensions Width: 3.8 mm Height: 30 mm Weight: 20 g Depth: 69.6 mm
Packaging data Package depth: 14 mm Package width: 95.2 mm Package weight: 46.21 g Package height: 171.4 mm
Safety warning Warnings: Keep out of the reach of children., Disposal of electronic products should be in accordance with local regulations for the recycling of electronic equipment., Do not disassemble or damage the memory modules, they may contain substances hazardous to health.