Features JEDEC standard: Yes Module configuration: 1024M x 64 Memory ranking: 1 Lead plating: Gold Memory voltage: 1.35 V CAS latency: 17 Programming power voltage (VPP): 2.5 V Intel Extreme Memory Profile (XMP): Yes Internal memory: 8 GB Refresh row cycle time: 350 ns Row active time: 32 ns Memory layout (modules x size): 1 x 8 GB ECC: No Memory form factor: 288-pin DIMM Intel Extreme Memory Profile (XMP) version: 2.0 Cooling type: Heatsink Backlight colour: Red/Green/Blue Buffered memory type: Unregistered (unbuffered) Component for: PC Backlight: Yes SPD profile: Yes Internal memory type: DDR4 Memory data transfer rate: 3600 MT/s Row cycle time: 45.75 ns
Operational conditions Operating temperature (T-T): 0 - 70 °C Storage temperature (T-T): -40 - 85 °C
Weight & dimensions Height: 43 mm Width: 8.2 mm Depth: 133.3 mm Weight: 46.82 g
Packaging data Package depth: 14 mm Package width: 57.1 mm Package height: 171.4 mm Package weight: 67.2 g
Other features Country of origin: Taiwan, China
Logistics data Master (outer) case length: 325.1 mm Products per master (outer) case: 25 pc(s) Master (outer) case gross weight: 1.91 kg Master (outer) case height: 88.9 mm Master (outer) case width: 193 mm